DP-IF4000
Notes on chip component replacementTABLE OF CONTENTS
Y Never reuse a disconnected chip component.
Y Notice that the minus side of a tantalum capacitor may beSpecifications ............................................................................ 1
damaged by heat.
1.GENERAL...................................................................3Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
2.DISASSEMBLYfree mark (LF) indicating the solder contains no lead.
2-1. Disassembly Flow ........................................................... 5(Caution: Some printed circuit boards may not come printed with
2-2. Cabinet (Lower), Luminous Window, IF Board.............. 5the lead free mark due to their particular size.)
2-3. TX Board ......................................................................... 6
3.ELECTRICAL ADJUSTMENT.............................7 : LEAD FREE MARK
Unleaded solder has the following characteristics.4.DIAGRAMS
YUnleaded solder melts at a temperature about 40°C higher than4-1. Block Diagrams ............................................................... 9
ordinary solder.4-2. Printed Wiring Board � IF Board Section � .................... 10
Ordinary soldering irons can be used but the iron tip has to be4-3. Schematic Diagram � IF Board Section � ....................... 11
applied to the solder joint for a slightly longer time.4-4. Printed Wiring Board � TX Board Section (Side A) � .... 12
Soldering irons using a temperature regulator should be set to4-5. Printed Wiring Board � TX Board Section (Side B) � .... 13
about 350°C.4-6. Schematic Diagram � TX Board Section (1/2) � ............ 14
Caution: The printed pattern (copper foil) may peel away if4-7. Schematic Diagram � TX Board Section (2/2) � ............ 15
the heated tip is applied for too long, so be careful!4-8. IC Pin Function Descriptions .......................................... 16
Y Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)5.EXPLODED VIEWS
than ordinary solder so use caution not to let solder bridges5-1. Processor Section ............................................................ 21
occur such as on IC pins, etc.
Y Usable with ordinary solder6.ELECTRICAL PARTS LIST..................................22
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Y Repaier DP-IF4000 with MDR-IF4000.
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ACEC
