D-EJ360/EJ368CK
Ver 1.1 2003.03
TABLE OF CONTENTS
DANGERSpecifications ............................................................................ 1
Invisible laser radiation when open and interlock failed or defeated.
Avoid direct exposure to beam.1. SERVICING NOTES...................................................3
CAUTION
2. GENERAL
Locating the Controls......................................................... 3Use of controls or adjustments or performance of procedures other
than those specified herein may result in hazardous radiation
exposure.
3. DISASSEMBLY
3-1. Upper Lid ASSY, Cabinet (Upper) Sub ASSY ........... 4
Flexible Circuit Board Repairing
3-2. MD ASSY, Main Board .............................................. 5
Y Keep the temperature of the soldering iron around 270°C during
3-3. OMotor ASSY (Sled) (M902)�,repairing.
Optical Pick-up (DAX-25E),
Y Do not touch the soldering iron on the same conductor of the
OMotor ASSY, Turn Table (Spindle) (M901)� ............ 5
circuit board (within 3 times).
Y Be careful not to apply force on the conductor when soldering or
4. ELECTRICAL ADJUSTMENS...............................6unsoldering.
Notes on chip component replacement5. DIAGRAMS
Y Never reuse a disconnected chip component.5-1. Block Diagram............................................................ 7
Y Notice that the minus side of a tantalum capacitor may be dam-5-2. Printed Wiring Boards �MAIN Section (1/2)� ........... 8
aged by heat.5-3. Printed Wiring Boards �MAIN Section (2/2)� ........... 9
5-4. Schematic Diagram �MAIN SECTION (1/3)� ....... 10
5-5. Schematic Diagram �MAIN SECTION (2/3)� ........11
z5-6. Schematic Diagram �MAIN SECTION (3/3)� ....... 12 UNLEADED SOLDER
5-7. IC Pin Function Description ..................................... 16Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
6. EXPLODED VIEWS
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)6-1. Cabinet Section ......................................................... 18
6-2. Optical pick-up Section (CDM-3325ER) ................. 19
7. ELECTRICAL PARTS LIST...................................20 : LEAD FREE MARK
Unleaded solder has the following characteristics.
Y Unleaded solder melts at a temperature about 40°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
SAFETY-RELATED COMPONENT WARNING!!
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
to about 350°C.
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE
Caution: The printed pattern (copper foil) may peel away ifPARTS LIST ARE CRITICAL TO SAFE OPERATION.
the heated tip is applied for too long, so be careful!REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
Y Strong viscosityPART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
Unleaded solder is more viscous (sticky, less prone toSUPPLEMENTS PUBLISHED BY SONY.
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
Y Usable with ordinary solder
It is best to use only unleaded solder but unleaded solderATTENTION AU COMPOSANT AYANT RAPPORT
may also be added to ordinary solder. A LA S�CURIT�!!
LES COMPOSANTS IDENTIFI�S PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCH�MATIQUES ET LA LISTE DES
PIECES SONT CRITIQUES POUR LA S�CURIT� DE
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
QUE PAR DES PIECES SONY DONT LES NUM�ROS SONT
DONN�S DANS CE MANUEL OU DANS LES SUPPL�MENTS
PUBLI�S PAR SONY.
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