Power consumptionTABLE OF CONTENTS
AC 15 W
Battery lifeSpecifications ........................................................................... 1
For CD radio cassette-corder:
FM recording1. SERVICING NOTES....................................................3
Sony R20P:approx. 7.5 h
Sony alkaline LR20:approx. 22 h2. GENERAL.......................................................................4
Tape playback
Sony R20P:approx. 7 h3. DISASSEMBLY
Sony alkaline LR20:approx. 20 h3-1. Cabinet (Rear) .......................................................... 6
3-2. Power Board, Back up Board, Battery Board........... 6CD playback
3-3. CD Block ASSY ....................................................... 7
Sony R20P:approx. 3 h
3-4. Control Board ........................................................... 7Sony alkaline LR20:approx. 10 h
3-5. Power Key Board, Mega Bass Board,
For memory back-up: approx. 1 year
Preset Board, Volume Board ..................................... 8Dimensions
3-6. Key Board................................................................. 8
Approx. 650 x 265 x 256 mm (w/h/d)
5113-7. Headphone Board ..................................................... 8(25 �8 x 10 �2 x 10 �8 inches) (incl. projecting parts)
Mass3-8. REC SW Board, PB Board ....................................... 9
Approx. 6.7 kg (14 lb. 12 oz) (incl. batteries)3-9. Mechanism Deck ...................................................... 9
Supplied accessory3-10. Capstan/reel Motor (M301), Belt ........................... 10
AC power cord (1)3-11. Main Board ............................................................. 10
Remote control (1)3-12. CD Board.................................................................11
3-13. Optical pick-up Block .............................................11Design and specifications are subject to change without notice.
4. ADJUSTMENTS
4-1. Mechanical Adjustments........................................... 12
4-2. Electrical Adjustments .............................................. 12
CAUTION
Use of controls or adjustments or performance
5. DIAGRAMS
of procedures other than those specified herein
5-1. Explanation of IC Terminals..................................... 15may result in hazardous radiation exposure.
5-2. Block Diagrams ........................................................ 17
5-3. Schematic Diagram (Main Section) ......................... 21Flexible Circuit Board Repairing
5-4. Printed Wiring Boards (Main Section) ..................... 25
Y Keep the temperature of the soldering iron around 270°C during
5-5. Printed Wiring Boards (Control Section) ................. 28repairing.
5-6. Schematic Diagram (Control Section)...................... 31
Y Do not touch the soldering iron on the same conductor of the
5-7. Printed Wiring Boards (CD Section) ........................ 34circuit board (within 3 times).
5-8. Schematic Diagram (CD Section) ............................ 37
Y Be careful not to apply force on the conductor when soldering or
unsoldering.
6. EXPLODED VIEWS
6-1. Rear Cabinet Section............................................... 44Notes on chip component replacement
6-2. Front Cabinet Section.............................................. 45
Y Never reuse a disconnected chip component.
6-3. CD Section .............................................................. 46Y Notice that the minus side of a tantalum capacitor may be dam-
6-4. Tape Mechanism Section-1 (MF-ZW755-117) ....... 47
aged by heat.
6-5. Tape Mechanism Section-2 (DECK A)
(MF-ZW755-117) ................................................... 48
6-6. Tape Mechanism Section-3 (DECK A)
(MF-ZW755-117) ................................................... 49 NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT6-7. Tape Mechanism Section-4 (DECK B)
(MF-ZW755-117) ................................................... 50
The laser diode in the optical pick-up block may suffer electro-
6-8. Tape Mechanism Section-5 (DECK B)static breakdown because of the potential difference generated
(MF-ZW755-117) ................................................... 51
by the charged electrostatic load, etc. on clothing and the human
6-9. Optical pick-up Section (KSM-213CDM) .............. 52body.
6-10.Speaker Section ....................................................... 53
During repair, pay attention to electrostatic breakdown and also
use the procedure in the printed matter which is included in the
7. ELECTRICAL PARTS LIST....................................54
repair parts.
The flexible board is easily damaged and should be handled
SAFETY-RELATED COMPONENT WARNING!!with care.
NOTES ON LASER DIODE EMISSION CHECKCOMPONENTS IDENTIFIED BY MARK ! OR DOTTED LINE WITH
The laser beam on this model is concentrated so as to be focusedMARK ! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
on the disc reflective surface by the objective lens in the opticalLIST ARE CRITICAL TO SAFE OPERATION.
pick-up block. Therefore, when checking the laser diodeREPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
emission, observe more than 30 cm away from the objective
SUPPLEMENTS PUBLISHED BY SONY.lens.
� 2 � |
ACEC
