Ver 1.1 2000. 08
SERVICE NOTESTABLE OF CONTENTS
1. GENERAL
Location of controls................................................................. 3
Getting Started......................................................................... 3
Setting the clock ...................................................................... 3
CD Player CD/MD unit ........................................................... 4
Radio ....................................................................................... 5
RDS ......................................................................................... 6
Other Functions ....................................................................... 7This product is classified as a CLASS 1 LASER PRODUCT.
Connections ............................................................................. 8This label is located on the bottom of the
chassis.
2. DISASSEMBLY
2-1. Sub Panel Assy .................................................................. 12
2-2. CD Mechanism Block ....................................................... 12
2-3. Main Board ....................................................................... 13
2-4. Heat Sink ........................................................................... 13
2-5. Chassis (T) Assy................................................................ 14
2-6. Lever Assy ......................................................................... 14This label is located on the drive unit's internal
2-7. Servo Board ....................................................................... 15chassis.
2-8. ARM Roller Assy .............................................................. 15
2-9. Chassis (OP) Assy ............................................................. 16
When replacing the chassis (T) of mechanism deck which have
2-10. Optical Pick-up Block ....................................................... 16the OCAUTION LABEL� attached, please be sure to put a new
CAUTION LABEL (3-223-913-11) to the chassis (T).
3. DIAGRAMS
3-1. IC Pin Descriptions ........................................................... 17
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK3-2. Block Diagram �CD Section�........................................... 23
OR BASE UNIT3-3. Block Diagram �Tuner Section� ....................................... 24
The laser diode in the optical pick-up block may suf3-4. Block Diagram �Display Section�fer electrostatic.................................... 25
breakdown because of the potential difference generated by the3-5. Circuit Boards Location .................................................... 25
charged electrostatic load, etc. on clothing and the human body3-6. Printed .Wiring Boards �CD Mechanism Section�............ 26
During repair, pay attention to electrostatic breakdown and also use3-7. Schematic Diagram �CD Mechanism Section (1/2)� ....... 28
the procedure in the printed matter which is included in the repair3-8. Schematic Diagram �CD Mechanism Section (2/2)� ....... 29
parts.3-9. Printed Wiring Board �Main Section� .............................. 30
The flexible board is easily damaged and should be handled with3-10. Schematic Diagram �Main Section (1/3)� ........................ 32
care.3-11. Schematic Diagram �Main Section (2/3)� ........................ 33
3-12. Schematic Diagram �Main Section (3/3)� ........................ 34
NOTES ON LASER DIODE EMISSION CHECK3-13. Schematic Diagram �Sub (CD) Section�.......................... 35
The laser beam on this model is concentrated so as to be focused on3-14. Printed Wiring Board �Sub (CD) Section� ....................... 36
the disc reflective surface by the objective lens in the optical pick-3-15. Printed Wiring Board �Key Section� ................................ 37
up block. Therefore, when checking the laser diode emission, ob-3-16. Schematic Diagram �Key Section�................................... 38
serve from more than 30 cm away from the objective lens.
4. EXPLODED VIEWS
4-1. Chassis Section ................................................................. 42Notes on Chip Component Replacement
4-2. Front Panel Section ........................................................... 43" Never reuse a disconnected chip component.
" Notice that the minus side of a tantalum capacitor may be dam-
4-3. CD Mechanism Section (1) ............................................... 44aged by heat.
4-4. CD Mechanism Section (2) ............................................... 45
4-5. CD Mechanism Section (3) ............................................... 46
5. ELECTRICAL PARTS LIST........................................47
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
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ACEC
