SERVICING NOTES
DISC MAGAZINE GETTING OUT PROCEDURE
NOTES ON HANDLING THE OPTICAL PICK-
ON THE POWER SUPPLY IS OFF
UP BLOCK OR BASE UNIT
Remove the COVER (LOWER.T) assOy beforehand
The laser diode in the optical pick-up block may suffer electro-
static breakdown because of the potential difference generated by
1) Press the lever (ML.S) to arrow direction.
the charged electrostatic load, etc. on clothing and the human body.
2) Removal the magazine assy.
During repair, pay attention to electrostatic breakdown and also
Note: Take out the magazine only when the tray is completely within the
use the procedure in the printed matter which is included in the
magazine. If the disk or tray is sticking out, turn on the power and
repair parts.
eject the magazine.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Lever (ML.S)
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
US/Canadian model:
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical
pick-up block.
Magazine assy
OPTICAL
PICK-UP
BLOCK
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
Y Never reuse a disconnected chip component.
Y Notice that the minus side of a tantalum capacitor may be dam-
SEMI-FIXED
aged by heat.
RESISTOR
Flexible Circuit Board Repairing
Y Keep the temperature of the soldering iron around 270 uC dur-
AEP/UK model:ing repairing.
Y Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Y Be careful not to apply force on the conductor when soldering
CLASS 1or unsoldering.
LASER PRODUCT
SAFETY-RELATED COMPONENT WARNING!!
The CLASS 1 LASER PRODUCT label is
located on the rear exterior.COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
CAUTION INVISIBLELASERRADIATION WHEN OPENAND IN THE PARTS LIST ARE CRITICAL TO SAFE
DO NOT STARE INTO BEAM OROPERATION. REPLACE THESE COMPONENTS WITH
VIEW DIRECTLY WITH OPTICAL INSTRUMENTS
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
This label is located on the drive unitOs internal chassis.
ATTENTION AU COMPOSANT AYANT RAPPORT
When replacing the chassis (U.S) sub assy of mechanism deck
� LA S?CURIT?!
which have the OCAUTION LABEL� attached, please be sure to
put a new CAUTION LABEL (3-223-913-11) to the chassis (ULES COMPOSANTS IDENTIFI?S P.S)AR UNE MARQUE 0
sub assy.SUR LES DIAGRAMMES SCH?MATIQUES ET LA LISTE
DES PIéCES SONT CRITIQUES POUR LA S?CURIT?
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIéCES SONY DONT LES
NUM?ROS SONT DONN?S DANS CE MANUEL OU
DANS LES SUPPL?MENTS PUBLI?S PAR SONY.
2 |
ACEC
