Ver 1.1 2000. 08
SERVICE NOTESTABLE OF CONTENTS
1. GENERAL
Location of controls................................................................. 3
Getting Started......................................................................... 3
Setting the clock ...................................................................... 3
CD Player ................................................................................ 3
Radio ....................................................................................... 4
RDS ......................................................................................... 4
This product is classified as a CLASS 1 LASER PRODUCT.
Other Functions ....................................................................... 6
This label is located on the bottom of the
Additional Information ............................................................ 7
chassis.
Connections ............................................................................. 8
2. DISASSEMBLY
2-1. Sub Panel Assy .................................................................. 10
2-2. CD Mechanism Block ....................................................... 10
2-3. Main Board ....................................................................... 11
2-4. Heat Sink ........................................................................... 11
2-5. Chassis (T) Assy................................................................ 12
This label is located on the drive unit's internal
2-6. Lever Assy ......................................................................... 12
chassis.
2-7. Servo Board ....................................................................... 13
2-8. ARM Roller Assy .............................................................. 13
When replacing the chassis (T) of mechanism deck which have
2-9. Chassis (OP) Assy ............................................................. 14
the OCAUTION LABEL� attached, please be sure to put a new
2-10. Optical Pick-up Block ....................................................... 14
CAUTION LABEL (3-223-913-11) to the chassis (T).
3. DIAGRAMS
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK3-1. IC Pin Descriptions ........................................................... 15
OR BASE UNIT3-2. Block Diagram �CD Section�........................................... 21
The laser diode in the optical pick-up block may suf3-3. Block Diagram �Tfer electrostaticuner Section� ....................................... 22
breakdown because of the potential difference generated by the3-4. Block Diagram �Display Section� .................................... 23
charged electrostatic load, etc. on clothing and the human body3-5. Circuit Boards Location..................................................... 23
During repair, pay attention to electrostatic breakdown and also use3-6. Printed Wiring Boards �CD Mechanism Section�............ 24
the procedure in the printed matter which is included in the repair3-7. Schematic Diagram �CD Mechanism Section (1/2)� ....... 26
parts.3-8. Schematic Diagram �CD Mechanism Section (2/2)� ....... 27
The flexible board is easily damaged and should be handled with3-9. Printed Wiring Board �Main Section� .............................. 28
care.3-10. Schematic Diagram �Main Section (1/3)� ........................ 30
3-11. Schematic Diagram �Main Section (2/3)� ........................ 31
NOTES ON LASER DIODE EMISSION CHECK3-12. Schematic Diagram �Main Section (3/3)� ........................ 32
The laser beam on this model is concentrated so as to be focused on3-13. Schematic Diagram �Sub (CD) Section�.......................... 33
the disc reflective surface by the objective lens in the optical pick-3-14. Printed Wiring Board �Sub (CD) Section� ....................... 34
up block. Therefore, when checking the laser diode emission, ob-3-15. Printed Wiring Board �Key Section� ................................ 35
serve from more than 30 cm away from the objective lens.3-16. Schematic Diagram �Key Section�................................... 36
Notes on Chip Component Replacement
4. EXPLODED VIEWS
" Never reuse a disconnected chip component.
4-1. Chassis Section ................................................................. 40
" Notice that the minus side of a tantalum capacitor may be dam-
4-2. Front Panel Section ........................................................... 41
aged by heat.
4-3. CD Mechanism Section (1) ............................................... 42
4-4. CD Mechanism Section (2) ............................................... 43
4-5. CD Mechanism Section (3) ............................................... 44
5. ELECTRICAL PARTS LIST........................................45
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
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ACEC
