TABLE OF CONTENTSMODEL IDENTIFICATION
N BACK PANEL N
1. SERVICING NOTE...........................................................3
2. GENERAL ....................................................................4
3. DISASSEMBLY
3-1. Front Panel Assembly....................................................... 15
4-983-366-
3-2. Back Panel Assembly ....................................................... 15
3-3. Table Assembly ................................................................ 16
3-4. Mechanism Deck .............................................................. 17
CX270 :US Model: 0
3-5. Base Unit .......................................................................... 17
CX270 :Canadian Model: 1
CX270 :AEP,German Model : 2
4. TEST MODE...............................................................18
CX90ES :US Model: 3
CX90ES :Canadian Model: 4
5. ADJUSTMENTS
5-1. Mechanical Adjsument ..................................................... 21
5-2. Electrical Block Checking ................................................ 27
CAUTION
6. DIAGRAMSUse of controls or adjustments or performance of procedures
6-1. Circuit Boards Location ...................................................other than those specified herein may r31esult in hazardous ra-
6-2. IC Pin Functiondiation exposure.
Y IC101 Digital Servo, Digital Signal Processor
(CXD2545Q) ................................................................ 32
Y IC401 System Control (MB90677) ..............................The laser component in this product35
Y IC407 OSD (MB90095-OEM166) ................................is capable of emitting radiation38
6-3. Block Diagram .................................................................exceeding the limit for Class 1.39
6-4. Printed Wiring Board N BD, DISP Section N ............... 43
6-5. Schematic Diagram N BD, DISP Section N .................. 47
6-6. Printed Wiring Board N MAIN Section N ..................... 51This appliance is classified as
6-7. Schematic Diagram N MAIN Section N........................ 55a CLASS 1 LASER product.
6-8. IC Block Diagrams ...........................................................The CLASS 1 LASER60
PRODUCT MARKING is
7. EXPLODED VIEWSlocated on the rear exterior.
7-1. Case and Back Panel Section ........................................... 65
7-2. Disc table Section ............................................................. 66
This caution label
7-3. Front panel Section...........................................................67
is located inside
7-4. Mechanism Section-1 (CDM-40) ..................................... 68
the unit.
7-5. Mechanism Section-2 (CDM-40) ..................................... 69
7-6. Base Unit Section-1 (KSM-213BKN/M-N) ..................... 70
7-7. Base Unit Section-2 (KSM-213BKN/M-N) ..................... 71
8. ELECTRICAL PARTS LIST........................................72
Notes on chip component replacement
Y Never reuse a disconnected chip component.
Y Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
Y Keep the temperature of soldering iron around 270uC
during repairing.
Y Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
Y Be careful not to apply force on the conductor when soldering
or unsoldering.
N 2 N |
ACEC
